The source materials must be clean.
The chamber must be pumped down to < 1e-6 Torr before introducing the argon
sputter gas.
There must not be any leaks.
I'd sputter the Cu right after sputtering the Ti to reduce the possibility
of oxidizing the Ti.
I'd use 50 to 200 A of Ti.
Do a presputter of each target to remove any oxidation before doing the
actual deposition.
If the Cu is thicker and higher stress, it is more likely to peel.

----- Original Message -----
From: "B. Sivagnanam" 
To: 
Sent: Monday, September 06, 2004 6:52 PM
Subject: [mems-talk] Sticking problem of evaporated copper on titanium


> Dear Mr Williams,
>
> I am Siva from Advanpack Solutions Pte Ltd., Singapore.
>
> I need to know what are the factors that affect adhesion between Sputtered
> Ti and Sputterd Cu. Ti and Cu are sputtered in sequence without breaking
the
> vacuum.
>
> Regards,
>
> Siva
> AdvanPack Solutions Pte Ltd.,
> 2,Woodlands sector 1
> #05-33
> Singapore 738 068
> DID 65- 6550 3226
> Fax 65- 6555 5838
> e-mail : bsiva@advanpack.com
> www.advanpack.com
>
> This transmission contains information belonging to Advanpack Solutions
Pte
> Ltd, and may be confidential and/or legally privileged. The information is
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