Does anybody know a way to locally remove a thin gold/titanium film? Say
open up 0.1-1mm diameter holes in a Au/Ti (200/15nm) film on a silicon
wafer without damaging the silicon? The placement accuracy of the holes
need to be +/- 100µm. Regular lithography cannot be used since the film
should remain untouched with polymers. Are there any kinds of laser
processing or similar that can be used? Any ideas?

                      Regards,

                      Patrik