Date: Wed, 15 Sep 2004 17:09:45 +0200
From: Patrik M?ller 
Subject: [mems-talk] thin film metal removal / patterning
To: 
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Does anybody know a way to locally remove a thin gold/titanium film? Say
open up 0.1-1mm diameter holes in a Au/Ti (200/15nm) film on a silicon
wafer without damaging the silicon? The placement accuracy of the holes
need to be +/- 1005m. Regular lithography cannot be used since the film
should remain untouched with polymers. Are there any kinds of laser
processing or similar that can be used? Any ideas?

                      Regards,

                      Patrik


Hello Patrik,
You can do it with Excimer laser micromachining technique. For KrF laser
(wavelength 248nm)I would suggest energy density about 0.4J/cm2. Please,
check our website www.laserusa.com for more information.

Regards,
Alex Pozdin