the ti and cu are 500A thick (each); those two layers were sputtered. Then
nickel (50 microns) is deposited via electroless plating.

MT Klaus Beschorner  wrote:
> Has anyone sputtered titanium on a ceramic type material (we are using Macor)?
> We have had good adhesion of titanium on ceramic but when other layers
> are added (cu and nickel in that order), it peels off.

Hm, interesting stack...

Are you sure that what you're depositing first is still Ti on the Macor,
and not just Titanium Oxides, Nitrides, Carbides due to a very dirty
surface? Can you measure specific resistivity?

Ti usually adheres very well to clean surfaces, so chemical clean and
in-situ Ar sputter clean may help improve that. Cu and Ni can have very
high stress if sputtered at low pressures, and Cu does stick better
to CrCu or Cr or Ta or TaN compared to Ti.

How thick are your layers?

--
Klaus Beschorner
Metron Technology Europe, PVD (Eclipse) Process Manager
Drosselweg 6,71120 Grafenau,Germany. Tel +49-7033-45683

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