This is a follow up question to a question asked a long time ago (I just
joined the list).
Back in February, Stefan mentioned that he used Aremco Crystal Bond 555 for
bonding two wafers for use in DRIE for through wafer etches.  However when
contacting Aremco they told me that the Crystal Bond series has no thermal
conductivity.  A high thermal conductivity between the wafers is important
for DRIE to achieve high anisotropy since a cool wafer temperature (20 deg
C) has to be maintained.  Our machine also has the ability to do cryo
etching, so the wafer must be at -110 deg C, making high thermal
conductivity even more important.

I have heard of a high thermal conductivity epoxy that is disolvable in
acetone, however I can't seem to find out exactly what it is.  Any suggestions?

Nicolas Duarte