I don't have direct experience, but I expect this is well within the
capability of FIB (focused ion-beam milling).

At 05:09 PM 9/15/2004 +0200, you wrote:
>Does anybody know a way to locally remove a thin gold/titanium film? Say
>open up 0.1-1mm diameter holes in a Au/Ti (200/15nm) film on a silicon
>wafer without damaging the silicon? The placement accuracy of the holes
>need to be +/- 100µm. Regular lithography cannot be used since the film
>should remain untouched with polymers. Are there any kinds of laser
>processing or similar that can be used? Any ideas?
>