Dear Markus,

You could use a cleaning spinner with a programmable dispense arm.

On the should be puddle /spray nozzle for DI-Water with a small quantity of a
detergent and ideal for final cleaning would be a DI-Water-Megasonicnozzle for
gentle cleaning of very small particles.
For final drying there should be a Nitrogen nozzle on the arm to support a low
spin speed dry spinning of the Wafer on the tape/dicing frame.
For general protection of the structures on the die you could use a protective
coating with a simple layer of photoresist or similar that could be removed
after the dicing/cleaning.

This process could be done in a simple cleaning spinner system either bench
mounted or standalone.

For more Information feel free to contact me directly.

Mit freundlichen Grüssen / Best Regards

Markus Reuter
Senior Sales Manager

SSE Sister Semiconductor Equipment GmbH
Josef-Schüttler-Str. 2
D-78224 Singen
GERMANY
Phone: +49 (0) 7731 189 - 230
Mobile: +49 (0) 151 1205 5053
Fax: +49 (0) 7731 189 - 100
m.reuter@sse-semi.com
WWW.QSSE.COM






-----Ursprüngliche Nachricht-----
Von: Markus Lohi [mailto:mplohi@paju.oulu.fi]
Gesendet: Mittwoch, 22. September 2004 18:36
An: mems-talk@memsnet.org
Betreff: [mems-talk] Diced wafer cleaning options

Hi all,

I am looking into different wafer cleaning options for diced silicon wafers.
Could somebody advise me with the most usual methods/equipment and their pros
and cons? We need a cheap process for low volume washing. The wafer is mounted
on an adhesive tape.

Thanks,
Markus