Hello all,

I'm experimenting with the following process:

a. Create a gold electrode pattern on a silicon wafer. (~5000A thick)
b. Spin a layer of pdms on top.
c. Pull off the later of PDMS so that the pattern is on the PDMS.

How can I (1) maximize the Au to PDMS adhesion and (2) minimize the PDMS
to Si adhesion -- so that I can peel the PDMS off without too much
stretching and have the pattern attached. (Stretching while peeling off
tends to damage the gold film.)

(3) Will PDMS stick more to Si or Si02?
(4) Will ebeam evaporated gold stick more to Si or Si02?


Any help is appreciated.

--
Rick Giuly
Laboratory for Neuroengineering
Georgia Institute of Technology