hello, Lift off would be a better option for this kind of problems,as you will not be needing any kind of wet etchant. If you prefer sticking by the previous method,I suggest you hard bake the photoresist at a temperature of 130 deg C for about 10-15 min. Later i also suggest that you descum using oxygen plasma.This should work for you. Regards, Rakesh Katragadda Graduate Researcher Wayne state university --- Vivek Mukhatyarwrote: > I was trying to spin coat aluminium with shipley > 1818 negative resist. > But when I used a wet etching solution the resist > wasn't able to > withstand the etchant. My patterns are on the scale > of microns and > the best way to etch is through wet etching because > i need to remove > alomost 300 micron thick aluminum. Does anyone know > the steps to spin > a thick layer of resist that will withstand the > etchant that is made > up of Hcl and CuCl2. I have SU-8 and 1818 to my > disposal. I also > need to remove the resist after the etching process. > > Thank you, > > Vivek Mukhatyar > _______________________________________________ > MEMS-talk@memsnet.org mailing list: to unsubscribe > or change your list > options, visit > http://mail.mems-exchange.org/mailman/listinfo/mems-talk > Hosted by the MEMS Exchange, providers of MEMS > processing services. > Visit us at http://www.memsnet.org/ > __________________________________________________ Do You Yahoo!? Tired of spam? Yahoo! Mail has the best spam protection around http://mail.yahoo.com