It depends on the power levels and etched time being used for the process.
For long etch times or high power etching, use Ti/Ni, Cr/Ni or NiCr.

-----Original Message-----
From: mems-talk-bounces@memsnet.org
[mailto:mems-talk-bounces@memsnet.org]On Behalf Of Sjoerd Haasl
Sent: Tuesday, November 02, 2004 10:03 AM
To: 'General MEMS discussion'
Subject: RE: [mems-talk] Dry etch mask


Hello Zhiyan,

Do you mean what mask to use for dry etching metal?
If so, normal photoresist should work for that. I have used a standard thin
resist (Shipley Megaposit SPR 700-1.2) for etching aluminum with Cl2/BCl3. I
etched 2 microns of aluminum with about 1.5 microns of resist.
Hope this was what you wanted to know.

Sjoerd Haasl

Royal Institute of Technology
Stockholm, Sweden


-----Original Message-----
From: Zhiyan Liu [mailto:zhiyanl@engr.colostate.edu]
Sent: den 30 oktober 2004 00:06
To: mems-talk@memsnet.org
Subject: [mems-talk] Dry etch mask


Dear all,

Does anybody has an idea of the dry etch metal mask. The dry etched i used
are Cl2/BCl3.

Thank you ,

Zhiyan



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