Peter,

Hi.  I recommend that you first perform an Ar ion clean (ablation) of the
surface prior to beginning your deposition and without breaking
vacuum.  Then, to deposit Au/Sn at 80%-20%, you really need an E-beam
system with two E-guns so that you can perform a co-deposition.  We have a
CHA Mark 50 dual E-beam/sputter/ion gun deposition system that should be
able to do what you need.  If you would be interested in talking with me
about it, please contact me.

Sincerely,

Robert Dean

Research Associate IV
Center for Advanced Vehicle Electronics
Auburn University
200 Broun Hall
Auburn, AL 36849
Voice: 334-844-1838


11/22/04, you wrote:
>Hi,
>Can anyone  advice how to deposit Au/Sn 80%-20% using e-beam or thermal
>deposition system? We need to deposit 3um thick layer on to a Au plated Cu
>holder.
>Please respond to
>Peter@plttechnology.com
>
>Thank you
>
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