Peeling of sputtered Ru is always a problem. Try capping it with some other metal like W. Cleaning method will probably not help. Niv ----- Original Message ----- From: Philippe CombetteDate: Friday, November 26, 2004 12:02 pm Subject: [mems-talk] RuO2 deposition > Hi all, > I have some difficulties in RuO2 films deposition by sputtering on > different substrates like SiO2 and SiNx low stress. When the > thickness is > more than 120 nm, the film peel off on SiNx. I tried different > clean > methods (RCA, pirahna, with or without HF dip), but finally after > few days, > the films peel off. Is anyone got the same difficulties ? > Thank you. > Philippe Combette > > _______________________________________________ > MEMS-talk@memsnet.org mailing list: to unsubscribe or change your list > options, visit http://mail.mems-exchange.org/mailman/listinfo/mems- > talkHosted by the MEMS Exchange, providers of MEMS processing > services.Visit us at http://www.memsnet.org/ >