Dear Mr. Laker,

We could do the etch using a KOH etch.  We could also convert one of our
existing machines to use XeF2, if it makes sense.  Our engineers would need
to have more technical details of your requirements in order to figure out
the
best solutions and for us to give you a quote.

Please give me a call if you are interested.  We also have a web site that
can provide more details on some of our services.  It is at
www.smsc.com/foundry.

Regards,


Douglas Finke
Vice-President and General Manager
Standard Microsystems Corporation
MEMS Wafer Foundry Business Unit
Phone: (516) 435-6004
Fax:       (516) 434-7360
Email:   finke@smsc.com



We have an immidiate application in high volume manufacturing for
etching silicon about 75u deep on both sides of the wafer.
Would love to chat with someone.
avi laker
Teccor Electronics
972-756-8237