I am looking for a foundry that can place a patterned metal of at least
100µm thickness onto a 4-inch wafer.  Some options for this would be direct
electroplating, or bonding patterned metal to the wafer.  The pattern would
be a grid of 170µm holes on 340µm pitch.  Metals can be gold or molybdenum
or anything with a reasonable thermal match to GaAs.

Any assistance would be greatly appreciated.

Brad Cantos
Dir. Wafer and Die Operations
Novalux, Inc.