If you are looking into depositing gold that thick (100 um), you probably want
electro-plating it, which many MEMS fabs can do. Typically silicon IC fabs do
not touch gold (or they do it in a separate building) because it is a lifetime
killer. I do not know about Molybdenum.

Regards,
Pierre x286
-----Original Message-----
From: mems-talk-bounces@memsnet.org [mailto:mems-talk-bounces@memsnet.org] On
Behalf Of Brad Cantos
Sent: December 22, 2004 13:29
To: MEMS discussion
Subject: [mems-talk] Foundry services recommendations

I am looking for a foundry that can place a patterned metal of at least
100µm thickness onto a 4-inch wafer.  Some options for this would be direct
electroplating, or bonding patterned metal to the wafer.  The pattern would
be a grid of 170µm holes on 340µm pitch.  Metals can be gold or molybdenum
or anything with a reasonable thermal match to GaAs.

Any assistance would be greatly appreciated.

Brad Cantos
Dir. Wafer and Die Operations
Novalux, Inc.

_______________________________________________
MEMS-talk@memsnet.org mailing list: to unsubscribe or change your list
options, visit http://mail.mems-exchange.org/mailman/listinfo/mems-talk
Hosted by the MEMS Exchange, providers of MEMS processing services.
Visit us at http://www.memsnet.org/