Hi Rameez
I feel two things from your situation
1. Aare you sure your wafer is clean enough so that you have good
adhesion between PR ang wafer? -->if wafer is not clean enough you are
gonna have PR debris or thin layer after developing in exposed area so
that if you try lift-off, then metal also can be peeled off.

2. Are you sure you have well defined PR process protocol? -> if you
did under exposure, again you will have thin layer of PR at exposed
layer, casuing lift-off of your metal layer as well as PR.

Good Luck

Sung

---------- Forwarded message ----------
From: Rameez Chatni 
To: mems-talk@memsnet.org
Date: Mon, 21 Mar 2005 13:57:55 -0500
Subject: [mems-talk] Problems with Lift-off
Dear Fellows,

I am trying to do a lift-off for a microfluidic chip and facing some problems. I
am using AZ9260 and then I exposed my mask onto it. Once the features were
defined, I evaporated Ti 200A and Pt 1200A onto the wafer.

When I tried the lift off, most of the metal broke off from the wafer and metal
on some features has been washed out completely. The part of the wafer with
AZ9620 also had a grainy metal surface.

It would be great if someone could help.

Rameez