Hi all,

I'm a PhD student (first year) at University of Rome (Italy).
I,m triyng to realize a lithographic process (optical contact lithography)
on a silicon wafer covered with one micron Si3N4.
The recipe I've always used for silicon dioxide doesn't work for Silicon
Nitride. I've also tried different (longer) exposure time but the
development step requires long time and the final thickness of resist is
very different from the expected value (500 nm instead of 1,5 micron).
I'using AZ5214 as photoresist because I need to reverse my pattern.
Does anyone can help me to find a new recipe?

Thanks a lot!

Federica


--
Federica Stella
Physics Department
University of Roma "Tor Vergata"