Hi there,
While bonding an oxidized silicon wafer (2000A oxide) to glass at 600V
and 400 degrees centigrade we encounter several cracks on the glass
wafer. The glass (Pyrex) is 170um thick, the silicon wafer is 350um
thick. The cracks are circular and about 3-8mm in diameter, and randomly
distributed across the wafer.

Thanks,
Andreas

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Andreas Jahn
National Institute of Standards and Technology
Semiconductor Electronics Divivision
100 Bureau Dr, MS 8120
Gaithersburg, MD 20899-8120

(Voice)   301-975-4710
(Email)   andreas.jahn@nist.gov
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