Dear Andreas,

There is a technique of bonding that uses a silicon based polymer that
softens at 180 C . The material is spun on and then baked to dry at 100 deg
c for 1 minute . Then the two surfaces to be bonded are spin coated with a
solution , baked and placed in contact with each other ,  then heated to
180-200 deg c , pressed together and allowed to cool.

The bonding silicon based polymer is heat resistive, alkaline ,acid, water
and organic solvent insoluble after used at 180 deg c. the bonded wafers
may be further cured at a higher temp of 400 deg in nitrogen.

It is possible that this technique may work well for you.

For more information contact John at 734 352 3790 xt 110 or mail him at
jbennett@filmtronics.com.

Hope this helps you.

Sincerely, Neal