I have a problem using Omnicoat as a release layer for SU-8 50. The SU-8
thickness is approx. 100 micorns. After developing SU-8 when I try to develop
Omnicoat in MF-319 (Shipley) for 30 seconds as advised by the company, it
doesnt seem to remove of completely. I have tried extended development times
but complete development is still not possible. I subjected the developed
wafer to a BHZF etch to remove the exposed oxide. Uneven removal of the oxide
confirmed the non-uniform development of Omnicoat. Any suggestions on this.

Thanks,

--
Aeraj ul Haque