hello,

Im trying to e-beam evaporate/sputter a seed layer on a negative resist. The
thickness of seed layer is around 2000A over patterned photo-resist of thickness
of 1.5 - 2 um. I would then spin, pattern another resist and electroplate
(that's why the seed layer).

My concern is discontinuity of the seed layer on top of the negative resist. Can
anyone suggest how i can deposit a continuous seed layer on top negative resist
by e-beam evaporation. Sputtering might be a easier way out. But Im more
interested in e-beam evaporation.

thanks,
krishna