Why don't you use O2 plasma followed by O2/SF6 RIE.

EH
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Eui H. Yang, Ph.D
Postdocoral Research Fellow of JSPS
Fujita lab., 3rd Div., IIS, The University of Tokyo
Tel:+81-3-3402-6231(ext. 2354)
Fax:+81-3-3402-5078
email:ehyang@fujita3.iis.u-tokyo.ac.jp
http://www.fujita3.iis.u-tokyo.ac.jp/~ehyang/yang.html
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Sergio Palma Pacheco wrote:
>
> I am using cured polyimide (PI 2545) as a sacrificial layer in a process
> to
> create long and wide airbridges.  I have been using hot (110C)
> Ethylenediamine
> to etch the polyimide, but it does not seem to remove all of the
> material
> underneath the bridges.  I have included holes to facilitate the
> diffusion of the
> etchant under the bridges as well as a stirrer, but to no avail.  Does
> anyone
> know of other etchants that could be used to remove the polyimide;
> especially
> underneath the bridges?  By the way, the bridges are made of chrome and
> electroplated gold.  Therefore, the etchants cannot attack these metals.
>
> Thanks,
>
>     Sergio
>
> --
>
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>      ,_| |._/\              Sergio Palma Pacheco
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>