Hello,

I need to anodically bond some die at near vacuum to fabricate a MEMS
device.  I have heard that anodic bonding in a near vacuum (~10e-6 Torr) is
somewhat different that anodic bonding at atmospheric conditions, but I do
not have any data on the procedural differences.  Does anyone have
experience with this and could describe the differences?

Sincerely,

Robert Dean
Auburn University