Dear All,

I need to etch through holes of very fine diameter (15,20,25,30 and 35
microns) in 450 um thick Silicon wafer. I am using 10 um thick AZ9260
photoresist as mask.

Standard bosch process is used. SF6- 130 sccm, C4F8-100 sccm, Platen
power - 150 W. After etching a long time, i could not etch them
completly. We have STS DRIE machine

Anyone would like to help me in this matter. What will be the optimum
parameters for though hole etching of very deep and narrow holes.

Thanks in advance.

Pradeep Dixit
Research Student,
NTU Singapore - 639669