Dear readers, This email did not make it cc'ed to mems-cc@isi.edu, so I am reposting. My apologies if both make it out at the same time. Raj ------- Forwarded Message To: Edward Chancc: mems-cc@isi.edu, Raj Gupta Reply-To: Raj Gupta Subject: Re: MUMPs 22 and test structures Date: Fri, 17 Apr 1998 01:21:01 -0400 From: Raj Gupta Edward, I took the liberty to include your initial question to me in this general email to the MEMS discussion group. Since it was a question designed to clarify the mechanical property extraction technique we used at MIT, I felt that it would be OK. First let me commend you for making good geometrical measurements, a point often overlooked in the process of mechanical property extraction. Second your question about how to define the beam lengths targets another major issue: understanding the effects of compliant supports. They can quite significantly affect the overall mechanical compliance a MEMS device, especially those fabricated by surface- micromachining, like those you find in the MUMPs devices. The lengths I report in my thesis for the MUMPs devices are labelled L1 in your drawing below. As you can guess, the added ~5um length along the lip of the support as well as the vertical anchoring segment ~2um contribute to bending compliance that can be approximated as a length offset to L1. Since bending compliance goes as 1/L^4, the effect of compliant supports especially on short 300um and 400um beams, such as the ones you tested, can be quite significant. Secondly, your beams are fixed-fixed (double-clamped). As a result, a length offset must be added for each of the two supports. The lower pull-in voltages (VPI) you report for the beams are not surprising. Compressive stress in your beams may be much higher than in the beams I investigated. This can drastically reduce VPI. Errors in correctly extracting the stress (due perhaps to the exclusion of the support compliance) will propogate to errors in the extracted modulus. Additionally, the concurrent pull-in measurements of cantilever (singly-clamped) beams, which have no net axial stress unlike the fixed-fixed beams, will help you separate the compliance due to the modulus from stress. And to reduce errors even further, I would highly recommend fitting our pull-in models to at least five different beam lengths of each type. If you have high compressive stress, you should design shorter length beams to avoid out of plane warpage and buckling. Lastly, W1 below represents the 40um widths of my beams. If my responses do not completely address your problem, let's talk. Raj Raj Gupta Microcosm Technologies, Inc. 100 S. Ellsworth Ave., Suite 400 San Mateo, CA 94401 (650)696-3198, FAX: (650)6969-3199 - ------- Forwarded Messages Date: Tue, 14 Apr 1998 15:32:11 -0700 (PDT) From: Edward Chan To: Raj Gupta cc: chan@gloworm.Stanford.EDU Subject: Re: Thesis Hi Raj, I am trying to use some of the data you presented in your thesis. Could you clarify the measured beam sizes you used? The MUMPs layout below describes what I mean: <------ length 2 -------- <---- length 1 ------- ^ -------+ | | | ^ ----+ +--------------------- width 1 | ////| | | ////| | width 2 ////| | | ////| | | ////| | v ----+ +--------------------- | | v -------+ Did you use/report length 1 or length 2? What is the difference between length 1 and length 2? What is the width of your stepup (width 1 and 2)? (These are for the fixed-fixed beams.) Many thanks in advance! +=========+=====================+===================================+ | Edward | Tel: (650) 723-1482 | CISX 305, Stanford, CA 94305-4075 | | Chan | Fax: (650) 725-7731 | chan@gloworm.stanford.edu | +=========+=====================+===================================+ - ------- Message 2 Date: Mon, 13 Apr 1998 13:51:37 -0700 From: Edward Chan Subject: MUMPs 22 properties To: MEMS@ISI.EDU Reply-To: Edward Chan , mems-cc@ISI.EDU Hi, I'm trying to determine the material properties of the polysilicon film (POLY1) of the MUMPs 22 run using the pull-in method of Gupta & Senturia (MIT). I am getting very low values for Young's Modulus (110 GPa). Biaxial stress is -6MPa. Compared to Gupta's thesis, I'm getting pull-in voltages of 29V for the 300um beam (compared to 50V by Gupta) and 14V for a 400um beam (compared to about 25V by Gupta). I've measured the film thickness (1.96um) and the gap (1.94um). The dice are placed in the Gel-Pak containers so no vacuum is applied to the back. Anyone else measure such values? Thanks! +=========+=====================+===================================+ | Edward | Tel: (650) 723-1482 | CISX 305, Stanford, CA 94305-4075 | | Chan | Fax: (650) 725-7731 | chan@gloworm.stanford.edu | +=========+=====================+===================================+ - ------- End of Forwarded Messages ------- End of Forwarded Message