Hi, all,

I have the following process flow, is it doable?

1. deposit a metal layer on substrate.
2. spin-coat a SU-8 layer on metal and develop the SU-8 to make contact hole for
the metal layer.
3. spin-coat a positive resist layer on SU-8 and develop by using the inverted
mask of the previous one, so that the contact hole go through the two resist
layer at the same place.
4. deposit another metal layer on the positive resist layer
5. lift-off the positive resist layer and have the second metal contact with the
first metal layer at the through hole. the first metal is otherwise protected by
the SU-8 layer.

Can the positive resist layer stick to the SU-8 layer?

Any suggestion is welcome. Thanks a lot.

Zhizhong