Hi Mathew,

There may be a way to do this reproducibly if you try backside exposure
through a glass wafer. An alternative would be to try micromoulding. As you
are aiming to fabricate an arch structure, release of the replica from the
mould should be no problem.

Regards,

Michael


>From: mathew varghese 
>Subject: [mems-talk] Reflow for SU-8 photoresist
>Date: Sat, 2 Jul 2005 22:01:47 -0700 (PDT)
>
>Hello..
>   My problem is, can SU8 photoresist be subjected to thermal overflow to
>produce an arch like structure on which metal can be deposited? I want to
>obtain a metal inductor in an arch like fashion after the SU8 is developed
>and removed.. Can somebody help please?
>