Dear All,

          I am trying to fabricate nano-pillars on Silicon wafer with DRIE
process. I want to leave the CF polymer coated during the DRIE process for
better surface finish. I found that the adhesion of this polymer to the
silicon is not good. There was a peeling of polymer at the edges of the
pillar base. Could anyone suggest the possible changes in the process to get
a better adhesion.

Thank you,

Arun