Hi,

I'm using S1813 and S1805 (thickness about 1.3µm and 500nm) as resist
for lift-off. I'm producing structures of a few hundreds of nanometers
in the resist on glass by illuminating with light.

I have two problems:
1. the size of the structures at the glass surface is about twice as big
as the size of the structures at the top. So I have a funnel in the
resist which is goinger bigger to the glass.

2. when I do the lift off (different thicknesses from about 50nm to
500nm gold) at the edges of the structures a wall of gold remains which
is several times higher than the thickness of the sputtered gold. In the
center of the structures the goldfilm is as thick as it should be. The
gold film is simply sputtered on the resist.

Knows anybody something about this problems and can help me.

Thanks
Sven