I have tried the same process for SU8 with mechanical/test grade
wafers and prime grade wafers. As soon as I clean them, there is no
difference in terms of adhesion, pattern quality. Mechanical grade
wafers may have some scratches on their surfaces which may not be a
problem if your photoresist thick enough.

Tolga

On 8/9/05, Zeta Tak For YU  wrote:
> If anyone can show me some reference or book about the effect of low
> quality wafer surface to the photolithography process of SU-8 or
> generally to PR. Thanks,