Kavin,
    This is highyl process dependent.  It will depend on whether it is
sputtered or CVD and then on the process paramters themselves (temperature,
process gases, gas pressures, etc.)  You need to do the measurement yourself
by measuring the curvature of a wafer before and after deposition.  There is
a well know formula relating this info to stress.

-Lou

>From: Kavin 
>Reply-To: General MEMS discussion 
>To: mems-talk@memsnet.org
>Subject: [mems-talk] Stresses of SiO2 and Si3N4
>Date: Fri, 19 Aug 2005 19:47:10 -0700 (PDT)
>
>Hello everyone,
>
>I am wondering whether anyone of you can inform me
>some data or reference on stresses of SiO2 deposited
>on poly-Si and Si3N4 deposited on SiO2?