I am looking for some advice on removing thin metal layers used as an
underbump metal layer in solder bump deposition.  My underbump metal
composition is:
400A Ti
500A Cu
400A Au
My bumps are PbSn solder.  Obviously, I want to minimize undercutting
the bumps, as well as minimize attack to the solder itself.

Hope someone can help!  Regards,

Keith McConnell
Children's Hospital Med Ctr
Cincinnati,  OH