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Date:    Mon, 04 May 1998 08:00:55 -0400
From:    "Waetzold, Sigurd" 
To:      MEMS 
Subject: Orientation dependent etching

Dear members,

We are pleased to inform you, that with the program QSIMODE a
further tool for the simulation of the orientation dependent
etching is available now.
By the help of the program QSIMODE, the cross-section through
the wafer during the etch process is simulated. So it is
possible to simulate 2-side etch technologies with and without
perforation of the wafer, and 2-side etch processes with a
change of the etchant and/or the etch mask in between. It is so
an excellent completion to the program SIMODE.

To become acquainted with the new simulation package, it is now
possible to receive a time limited version (2 months) of SIMODE
3.03 and QSIMODE 1.0 for a fee of 350 DM. The fee will be take
into account by selling one of the two software's SIMODE or
QSIMODE until 1.1.1999. This offer is valid until 1.7.1998.

Furthermore, you can get further explanations and examples from
our new designed webside:


http://gemac.c.ntg.de/mst_eng.htm

Please note, that both programs SIMODE and QSIMODE are also
usable for Windows NT now.

We would be very pleased to welcome you as a new user of our
simulation tool SIMODE or QSIMODE. If you have any questions,
do not hesitate to contact us.


Yours sincerely,

D. Zielke
GEMAC mbH
Department of Microsystems
Matthesstraáe 53
09113 Chemnitz
Germany
Tel.: +49 371 3377 104
FAX.: +49  371 3377 272
email: 100144.2036@compuserve.com
       gemac.chemnitz@t-online.de



P.S.: We are looking for distributors of our simulation package
for the US- and Japanese-market.


















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