Hi,
Maybe you can try thermal release tape form Nitto Denko.


 On 9/19/05, Noemi Graziana SPARTA'  wrote:
>
> Hello everyone,
>
> I'd like to bond (temporary) plastic substrates (PEN) to standard silicon
> wafers; this is why I'd like to have some information about thermal release
> adhesive layers (Temperature>150C).