Hi Chenhan,

In my experience it is better to turn the hotplate off and cool down the SU8
slowly, specially if the SU8 layer is thick. I had a lot of adhesion
problems with SU8 due to thermal stress due to heating or cooling the SU8
layers to fast.

The hard bake T is from 150-200C. Check the Microchem datasheets for SU8 for
more info: http://www.microchem.com/products/su_eight.htm

Good luck!

Sonia.


-----Message d'origine-----
De : Chen-Han Lee [mailto:dcl815@bham.ac.uk]
Envoyé : Monday, September 19, 2005 10:58 AM
À : Mems-Talk
Objet : [mems-talk] su-8 hardbake


hi,

could anyone tell what temperature and duration is usually used in hardbake
for su-8?
Once reached the desired time, do u remove it from the hotplate or turn the
hotplate off and leave the su-8 sample on it?