Greetings,
We use SU materials, however did not experience swelling.
I must add that our materials are baked at the highest temp given in the
data sheets.
Also we are able to remove the PR using An spinner rather than dipping etc
Typical removal time is 15 seconds for 2 microns.
Kind Regards
Walther
www.elume.com

-----Original Message-----
From: Silvan Schmid [mailto:silvan.schmid@micro.mavt.ethz.ch]
Sent: Monday, November 07, 2005 2:24 AM
To: mems-talk@memsnet.org
Subject: [mems-talk] Protection Layer for SU-8 Structures

Dear all,

I have SU-8 structures which I need to cover with a photoresist layer in
order to protect them during the dicing process. The solvent to remove
the protection layer should not alter the SU-8 (e.g. SU-8 will swell in
acetone).
Do you have any experience, which photoresist/developer pair is best
suited for this task?
Thanks!

Regards,
Silvan