Eric,

If it is a wafer, for better result of course you use a dicing saw to cut
the back side of your wafer but leave some height uncut to create a
scribe line. Then use a roller to press again the front side of the wafer
to cleave your wafer. Cutting the film directly will not give clean cross
section. Or, you make two molds that you can just insert the wafer on both
ends (like paper inserts into an envelope), then you can use both hands to
snap the wafer.

Yours sincerely,

Isaac Chan, PhD
University of Waterloo
"Innovate. Lead. Succeed."

On Mon, 7 Nov 2005, Eric J. Correa wrote:

> Hi Everyone:
>
> I am trying to measure UNCD (diamond) thickness using a SEM
> by looking at the cross sectional area.  I am using a
> diamond tip to cut my samples but I am not able to get a
> clean cross-sectional area.  I was just wondering if anyone
> has any advice or recommendation.
>