I've been using a TC Bond recipe that runs over 8 hours.  I'm sure a
much shorter time would suffice.  For padding I use 0.5 mm flexible
graphite from Goodfellow.  You may be able to reduce the bond pressure
if the temperature is increased.

Roger Shile

-----Original Message-----
 Subject: Re: [mems-talk] Au/Au thermocompression

Thanks Roger,

an additional information:
for how long you kept your samples in your machine? The temperature =20
you chose looks preaty low.
One more thing: what would you suggest as soft material (Al foil =20
perhaps?).

Lorenzo