Giuliano,
         Plasma etch in a Oxygen/CF4 mix at a high temperature.  One of
our customers etches 8 microns of hard baked Polymide in a 70% Oxygen,
30% CF4 mixture at 250 degrees C, in 4 minutes.  Contact me for more
details at bmoffat@yieldengineering.com


Bill Moffat, CEO
Yield Engineering Systems, Inc.
2185 Oakland Rd., San Jose, CA  95131
(408) 954-8353

-----Original Message-----
From: mems-talk-bounces@memsnet.org
[mailto:mems-talk-bounces@memsnet.org] On Behalf Of Giuliano Gregori
Sent: Wednesday, January 25, 2006 11:57 AM
To: General MEMS discussion
Subject: [mems-talk] polyimide dry-etch


Hello everybody,
what's a good process to dry-etch a HD 8820 polyimide sacrificial layer
2-3 micron thick ?
Thanks in advance !

Giuliano