----- Original Message -----
From: "GARCIA BLANCO Sonia" 
To: 
Sent: Friday, January 27, 2006 10:12 AM
Subject: [mems-talk] Residues after development using SU8 2075


> Dear All,
>
> I am having quite a lot of difficulty developping the recipe for
> 150microns
> thick layers of SU8 2075 on fused silica substrated sputtered with gold
> (4inch wafers). My main problems are:
>
> (a) Sticking of the wafer to the mask.
> (b) Some non-developped stuff stack to my patterns and I cannot get rid of
> that only if I reduce the dose and then, I begin havng some initiation of
> adhesion problems.
>


Hi Sonia,

   I have the similar problem of your first one before. I think that is
because your softbake didn't get rid of solvent in SU-8 completely. Try to
softbake at 95 degree C for a longer time. That should be able to solve the
problem. At least, it worked for me.

   I am not quite sure about your second problem. But I guess it might be
due to the reflection from your gold layer. That might expose some areas you
don't want to.

   Good Luck

Richard