To clarify: Aluminum is *not* attacked by XeF2. -Zeke > > Aluminum is highly stressed and easily attacked. Either alter the > deposition method/rate/etc. to reduce stress or switch materials. We make > nickel structures with much success. > > --Jason Tauscher > Silicon Designs, Inc. > www.silicondesigns.com > > -----Original Message----- > From: Robert Dean [mailto:rdean@memsoptical.com] > Sent: Saturday, June 13, 1998 2:32 PM > To: MEMS@ISI.EDU > Subject: aluminum bowing > > > Hello, > > I am trying to fabricate a suspended aluminum (99% Al, 0.5% Si, 0.5% Cu) > structure, 1.15um thick on a silicon wafer. The suspended length is > approximately 130um. After the structure is released etched from the > silicon using XeF2, the aluminum bridge bows and twists due to stresses. > What causes this and how can I prevent it? Thank you. > > Sincerely, > > Robert Dean > RF CMOS Designer > MEMS Optical > 205 Import Circle > Suite 2 > Huntsville, AL 35806 > Tel. 256-859-1886 > FAX 256-859-5890 > email rdean@memsoptical.com > > > > >