Good Morning Erkin. Your sputtered micro-strain gauge is very interesting. Do you have any information on size, resistance and possible applications? Kind Regards Graham -----Original Message----- From: mems-talk-bounces@memsnet.org [mailto:mems-talk-bounces@memsnet.org] On Behalf Of erkin seker Sent: Friday, February 10, 2006 1:39 PM To: General MEMS discussion Subject: [mems-talk] diffusion barrier for copper-polyimide [Spam?][mx] Hi, I am trying to make micro strain gauges using the following method in summary: - Spin 250nm-thick polyimide diluted with NMP; completely cure at 325C - Sputter/pattern 80nm-thick Cu/Ni on cured polyimide - Spin 250nm-thick polyimide diluted with NMP; completely cure at 325C The problem I am having is that after the cure, the polyimide above Cu/Ni layer is disappearing. I read about copper oxide diffusion into polyimide due to the reaction between copper and polyamic acid; but I am not sure if this explains the material loss over the metal lines. I already tried amino silane adhesion promoters provided by GE Silicone, but didn't have any success. I would be grateful if somebody could suggest a solution. Thank you very much. erkin _______________________________________________ Hosted by the MEMS and Nanotechnology Exchange, the country's leading provider of MEMS and Nanotechnology design and fabrication services. Visit us at http://www.mems-exchange.org Want to advertise to this community? See http://www.memsnet.org To unsubscribe: http://mail.mems-exchange.org/mailman/listinfo/mems-talk