Hi, Everyone

I am trying to do electroplating copper for about 2 to 5 um thickness on top of
the sacrificial layer of polymer.

Right now my lab has EPI E-Brite Ultra Cu solution, multimeter, hotplate,
magnetic stiring bar,voltage source, electrode clamps. I connected the circuits
with required current (10ASF), but seems the copper didn't grow on the seed
layer which is also copper.

I went back to the instruction sheet of the E-Brite Ultra Cu, it looked much
more complicated than I thought. Does anybody have the experience using the
E-Brite Ultra Cu solution ? Please give me some brief description of how to us
it.

My another question is: Can I use other materials as seed layer such as
aluminium ?

Any help will be appreciated. If you have experience with other plating
solutions, it is also welcome, I don't have to restrain to one only material.

Thanks
J.J.