Dear all,

I am new in this field and also this community.I am probably asking some silly
questions. Thanks for any help in advancen anyway.
I used SU8 3000 Series spin coated on nickel or silver surface. It was followed
by pre-bake for 11 mins at 95 C, exposure 7sec, PEB 1 mins @65C + 4 min @95C and
develop. Everything is ok until  electroplating in copper (strong acid) or gold
bath (strong basic) simply because Su8 layer detached from the metal surface.
Can anybody please give me some advice to overcome or just let me know ther it
is a unsolved problem.

Many thanks!

James