Vacuum hard bake will help.  Silylation which will implant silicon in
the resist surface will inhibit resist flow up to temperatures of 400
degrees C.  Think of turning the defined resist area onto an M @ M like
structure.  Goopy resist surrounded by a 5,000 to 20,000 angstrom thick
layer of silicon containing resist.  This creates the hard shell that
inhibits resist flow and contains the main body of the resist.


Bill Moffat, CEO
Yield Engineering Systems, Inc.
2185 Oakland Rd., San Jose, CA  95131
(408) 954-8353