I used AZP4620 and it AZ kwik striper remover to lift-off the metal deposition
but yield is too low. There are 64 sensors in one 3" wafer but only 4~5 sensors
are successful; the metal depostion of other devices are gone.
I used thermal evaporate to deposit the Ti and Cu layers.
If I use S1813 to lift-off the metal layer; whether it comes out a better
result. The metal layers are 30nm of Ti and 0.3 um Cu.
I need your guys' experiences.

Lung-hao Hu
Graduate Student
Dept.of Mechanical Engineering
Univ.of Colorado Boulder