Hi,

As the title suggests, I'm interested in high aspect ratio, sub-micron
lithography without spinning. For my application I'm trying to fab
optical gratings that are up to a micron deep with 300nm linewidth. I
don't know if I need it to be that deep, but I'd like for my process
to have that kind of flexibility. Also, I'm dealing with
non-wafer-like substrates that are quite heavy and spherically shaped,
so spinning resist on them doesn't seem practical.

I've heard of micro-contact printing (uCP) and micromolding in
capillaries (MIMIC). I don't know much about these. Can anyone comment
on the feature sizes they can achieve? Also, will I be able to follow
these up with a lift-off procedure that will leave nice, high-aspect
ratio structures?

Any input would be greatly appreciated,

Patrick Lu
http://www.stanford.edu/~patlu
Ph.D. Candidate
Department of Electrical Engineering
Stanford University


PS: Are there any other mailing lists out there that also deal with
microfab techniques?