> Who from the MEMS members can give me some advices about silicon-gold
> eutectic bonding.
> What is it, how can i do it and what parameter must i considere.
> Searching the web didn't give me any practicable informations.
>
> regards,
> Hamed Goré
> Auxitrol-RD dprmt
Dear Dr. Goré,
              The eutectic temperature for Au-Si system is around 363 degree
Centigrade, forming Au_4Si compound. I have attached the alloy phase diagram
for Au-Si system along with this mail. More details of the alloy-phase can
be found at the following references:
1. H. Okamoto and T. B. Massalski, Bull. Alloy Phase Diagrams, 4(2), (1983),
190.
2. W. G. Moffatt, The Handbook of Binary Phase Diagrams, Genium Publishing
Corporation, Schenectady, NY, USA, (1986), p.3/84.

Some interesting studies on formation of Gold-Silicide micro-structures
based on application of this alloy-pase data can be found at the below
references.

1. B. Rout et.al., J. Vac. Sci. Technol. B. 18(4) (2000), 1847.
2. K. Sekar et. al., Surf. Sci. 302,(1994) 25.
3. K. Sekar et. al., Solid State Communication, 96, (1995), 871.

Cheers,

Dr. Bibhudutta Rout
Research Scientist,
Louisiana Accelerator Center, PO Box - 42410
University of Louisiana at Lafayette, LA - 70504-2410, USA
Fax: 337-482-6190, Email: bibhu@louisiana.edu    Web:lac.louisiana.edu