Dear All ,

      I am using PECVD silicon nitride as a structural layer and Aluminum as
a sacrificial layer. First i want the patterning of nitride layer by RI
etching then wet etching of Aluminum layer ( releaging step ).
So if any know then please tell me what is recipe to etch the nitride layer
and the selectively by using PPR as a mask. what etchant i can use for
releasing step which will not attack on nitride layer.



Regards,
Deepak