Hi Cla, usually people measure stress by how much the substrate bows.  We
studied backgrinding stress by grinding to 80 microns thick and using a long
scan profilometer scan to measure the bow.  An inferometer can also be used.

Scott

-----Original Message-----
From: cla rai [mailto:fromsingawithlove@yahoo.it]
Sent: Tuesday, May 23, 2006 1:15 AM
To: General MEMS discussion
Subject: [mems-talk] stress induced by backgrinding


hi!!

  i want to study the stressed induced by backgrinding in a silicon
wafer..do somebody have an idea on how can i do that?